Features
Commodity Classification Automated Tracking System (CCATS):
G077159
Export Control Classification Number (ECCN):
5A992C
Embedded options available:
PCI Express CEM revision:
3.0
Supported instruction sets:
SSE4.2, AVX, AVX 2.0, AVX-512
PCI Express slots version:
3.0
Maximum number of PCI Express lanes:
48
General
Type:Characteristics of the device.
Processors
Graphics
Logistics data
Harmonized System (HS) code:
8542310001
Memory
ECC:ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Memory channels:
Hexa-channel
Memory clock speeds supported by processor:
2666 MHz
Memory types supported by processor:
DDR4-SDRAM
Maximum internal memory supported by processor:
768 GB
Operational conditions
Other features
Maximum internal memory:The maximum internal memory which is available in the product.
768 GB
Maximum internal memory:The maximum amount of memory inside a product, usually measured in bytes e.g megabytes (MB) or gigabytes (GB).
786432 MB
Packaging data
Package type:The type of product package e.g. box.
Retail box
Package weight:Weight of the packaged product.
201 g
Package height:The distance from the top to the bottom of the packaging.
112 mm
Package depth:The distance from the front to the back of the packaging.
137 mm
Package width:The distance from one side of the packaging to the other.
43 mm
Processor
Processor codename:
Skylake
Thermal Design Power (TDP):
150 W
Processor boost frequency:The turbo boost is an automatic, managed accelleration of the processor when one of the cores is overloaded.
3.7 GHz
Processor operating modes:Operating modes for the processors that place restrictions on the type and scope of operations for certain processes run by the CPU. This design allows the operating system to run with more privileges than application software.
64-bit
Component for:What this product is used as a part of (component for).
Server/workstation
Box:Plastic or metal shell/container for components.
Processor lithography:The process which is performed by the processor e.g. CPU (Central Processing Unit).
14 nm
Processor socket:Mechanical component(s) that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the processor to be replaced without soldering.
LGA 3647 (Socket P)
Processor cores:The number of central processing units ('cores') in a processor. Some processors have 1 core, others have 2 (e.g. Intel Core Duo) or more (e.g. the Intel Xeon E7-2850 has 10 cores).
20
Processor base frequency:
2.4 GHz
Processor model:The model number for the processor in a computer.
6148
Processor generation:
1st Generation Intel® Xeon® Scalable
Processor family:A family of processors is a group of processors produced by one company over a short period of time e.g. Intel Pentium processors.
Intel® Xeon® Gold
Processor manufacturer:The manufacturer that produced the processor.
Intel
Processor special features
AVX-512 Fused Multiply-Add (FMA) units:
2
Intel TSX-NI version:
1.00
Intel Turbo Boost Max Technology 3.0:
Intel Virtualization Technology (VT-x):Simplify Virtualization and Reduce Overheads\nIntel® Virtualization Technology (Intel® VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other.
Intel Virtualization Technology for Directed I/O (VT-d):Simplify Virtualization and Reduce Overheads\nIntel® Virtualization Technology (Intel® VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other.
Intel VT-x with Extended Page Tables (EPT):
Intel® Optane™ Memory Ready:
Intel® Run Sure Technology:
Intel® Volume Management Device (VMD):
Intel® vPro™ Platform Eligibility:
Mode-based Execute Control (MBE):
Intel® Transactional Synchronization Extensions:
Enhanced Intel SpeedStep Technology:
Intel Trusted Execution Technology:
Intel® AES New Instructions (Intel® AES-NI):Added Security with Faster Data Encryption\nThe Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI) enable fast and secure data encryption and decryption for better performance and less risk from timing and cache-based attacks than table-based software implementations. Intel AES-NI supports usages such as standard key lengths, standard modes of operation, and even some nonstandard or future variants.
Intel® Hyper Threading Technology (Intel® HT Technology):Improved Performance for Threaded Software\nIntel® Hyper-Threading Technology (Intel® HT Technology) makes efficient use of processor resources, enabling multiple threads to run on each core and increasing processor throughput. Available on Intel® Core™ and Intel® Xeon® processors, Intel HT Technology helps run demanding applications simultaneously, protect and manage systems, and provide headroom for business growth.
Intel® Speed Shift Technology:
Intel® Turbo Boost Technology:Higher Performance When You Need It Most\nIntel® Turbo Boost Technology 2.0 accelerates processor and graphics performance by increasing the operating frequency when operating below specification limits. The maximum frequency varies depending on workload, hardware, software, and overall system configuration.
2.0
Technical details
Intel® Run Sure Technology version:
1.00
Intel® Speed Shift Technology version:
1.00
Intel® Volume Management Device (VMD) version:
1.00
Memory speed (max):
2666 MHz
Mode-based Execute Control (MBE) version:
1.00
Processor brand name:
Intel Xeon Gold
Intel Xeon Gold Processor
Product family:
Intel Xeon Processors
Product type:The sub-category of the product.
Processor
Supported memory types:Types of memory which can be used with the product.
DDR4-SDRAM
Weight & dimensions
Processor package size:
76mm x 56.5mm
