Features
Intel Extreme Memory Profile (XMP) version:
2.0
Intel Extreme Memory Profile (XMP):
Memory voltage:The voltage (V) of the memory in the device.
1.35 V
CAS latency:Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
18
Component for:What this product is used as a part of (component for).
PC
Memory clock speed:The frequency at which the memory (e.g. RAM) runs.
3600 MHz
Internal memory type:The type of internal memory such as RAM, GDDR5.
DDR4
Memory layout (modules x size):
1 x 8 GB
Internal memory:A computer's memory which is directly accessible to the CPU.
8 GB
Buffered memory type:
Unregistered (unbuffered)
Operational conditions
Storage temperature (T-T):The minimum and maximum temperatures at which the product can be safely stored.
-20 - 65 °C
Operating temperature (T-T):The minimum and maximum temperatures at which the product can be safely operated.
0 - 85 °C
Packaging data
Package type:The type of product package e.g. box.
Box
Package weight:Weight of the packaged product.
82 g
Package height:The distance from the top to the bottom of the packaging.
15.5 mm
Package depth:The distance from the front to the back of the packaging.
150 mm
Package width:The distance from one side of the packaging to the other.
67 mm
Weight & dimensions
Weight:Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
67 g
Height:The measurement of the product from head to foot or from base to top.
8.2 mm
Depth:The distance from the front to the back of something.
133.3 mm
Width:The measurement or extent of something from side to side.
39.2 mm
