Features
Compatible products:Other products that can be used with this product.
Intel 300 Series,Intel 400 Series,Intel 500 Series,Intel 500 Series,AMD 300 Series,AMD 400 Series,AMD 500 Series,AMD X570
Backlight colour:
Red/Green/Blue
Backlight:Product has a built-in light source for its illuminating.
Cooling type:The method used to cool the device or to cool the air around the device.
Heatsink
Country of origin:Country where the device is made.
Taiwan
Intel Extreme Memory Profile (XMP) version:
2.0
Intel Extreme Memory Profile (XMP):
Memory voltage:The voltage (V) of the memory in the device.
1.35 V
Memory channels:
Dual-channel
CAS latency:Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
16
ECC:ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Memory form factor:Design of the memory e.g. 240-pin DIMM, SO-DIMM.
288-pin DIMM
Component for:What this product is used as a part of (component for).
PC/Server
Memory clock speed:The frequency at which the memory (e.g. RAM) runs.
3200 MHz
Internal memory type:The type of internal memory such as RAM, GDDR5.
DDR4
Memory layout (modules x size):
2 x 16 GB
Internal memory:A computer's memory which is directly accessible to the CPU.
32 GB
General
Type:Characteristics of the device.
Memory RAM
Logistics data
Harmonized System (HS) code:
84733020
Weight & dimensions
Height:The measurement of the product from head to foot or from base to top.
44 mm
