Quick Code: Q MPN: GP-ASM2NE6100TTTD
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Overview



World First PCIe 4.0x4 Controller
The World First PCIe 4.0x4 Controller, Phison PS5016-E16 controller, made by 28nm manufacturing technology. The advanced fabrication process ensures PS5016-E16 has enough compute power for ECC processing when adopting the latest 3D TLC NAND flash. PS5016-E16 also features eight NAND channels with 32 CE targets, DDR4 DRAM caching, and a PCIe 4.0x4 interface. As for features, the chip supports the NVMe 1.3 protocol, LDPC error correction, and Wear Leveling, Over-Provision technologies to improve reliability and durability of SSDs.

NAND Flash Selected for High Quality and Performance
TOSHIBA BiCS4 96 Layers 3D TLC (800MT's)
Toshiba BiCS4 NAND Flash optimizes circuitry and architecture by increasing to 96 layers for higher storage space per unit area. 800MT's throughput on the AORUS NVMe Gen 4 SSD far exceeds that of PCIe 3.0x4 devices for superior storage performance.

Xtreme Storage Performance
With the new PCIe 4.0 controller, AORUS NVMe Gen 4 SSD delivers blazing speeds: up to 5,000 MB's for sequential read, and up to 4,400MB's sequential write. Sequential Read performance of PCIe 4.0 SSDs is up to 40% faster than PCIe 3.0 SSDs. Get ready to enter the next generation of computing with faster and smoother, gaming, streaming, and graphics intensive rendering.

Full Body Copper Thermal Solution for Outstanding PCIe 4.0 SSD Performance
The Full Body Copper Heatsink takes into account the heat transfer from key components on both the front and back of the device, the controller and NAND Flash. Full copper heatsinks have 69% higher heat transfer capacity compared to aluminum heatsinks giving AORUS NVMe Gen4 SSD the best heat dissipation for read/write performance.

Efficient Copper Heat Spreader Design
Compared with a plated M.2 heat spreader, new efficient copper heat spreaders with 27 fins add more surface area which improve thermal transfer from heating sources to obtain thermal balance sooner. Moreover, Optimized fin array design does great heat exchange with any direction of air flow. Both unique design make sure key components of PCIe 4.0 SSD to keep suitable working temperature under ultra high transfer rate.

Why is keeping an SSDs at lower temperatures so important?
- Higher working temperature may cause data loss. The degradation factor of data loss could be a hundred times higher.
- With Full Body Copper Heat Spreaders, the AORUS NVMe Gen 4 SSD can operate at lower working temperatures to improve data storage reliability. Furthermore, SSDs can deliver extreme performance for longer periods.

SSD Tool Box
The newly updated SSD Tool Box is a software that gives users an overview of the SSD Status and various aspects such as model name, FW version, health condition and sensor temperature. Moreover, users can clear all the data with the Secure Erase function. You can download the SSD Tool Box from the link.




Specification


Technical Description:

Features
Mean time between failures (MTBF):Statistical model used to indicate product/mechanism reliability; expressed in hours and percentage of duty cycle. This number (in hours) does not indicate the mean time before failure for a single unit/mechanism.
1770000 h
S.M.A.R.T. support:
Yes
TRIM support:
Yes
Random write (4KB):
700000 IOPS
Random read (4KB):
750000 IOPS
Write speed:The speed at which a device can write data.
4400 MB/s
Read speed:The speed at which a device can read data.
5000 MB/s
Component for:What this product is used as a part of (component for).
PC/Laptop
Memory type:Type of memory in the device e.g. DDR3, SRAM (Static RAM).
3D TLC
NVMe version:
1.3
NVMe:
Yes
Interface:Interface ports to connect pieces of equipment. USB (Universal Serial Bus) has become the most popular wired interface to connect peripherals. USB 2.0 supports speeds up to 480 Mbit/s (USB 1: 12 Mbit/s). The interface FireWire is also known as the IEEE 1394 standard. Enhanced IDE (EIDE)is sometimes referred to as Fast ATA, Fast IDE or ATA-2.
PCI Express 4.0
SSD form factor:
M.2
SSD capacity:
1 TB

Logistics data
Harmonized System (HS) code:
84717070

Operational conditions
Storage temperature (T-T):The minimum and maximum temperatures at which the product can be safely stored.
-40 - 85 °C
Operating temperature (T-T):The minimum and maximum temperatures at which the product can be safely operated.
0 - 70 °C

Packaging data
Package type:The type of product package e.g. box.
Box
Manual:
Yes

Power
Power consumption (write):
6.6 W
Power consumption (read):
6.5 W

Weight & dimensions
Height:The measurement of the product from head to foot or from base to top.
11.4 mm
Depth:The distance from the front to the back of something.
23.5 mm
Width:The measurement or extent of something from side to side.
80.5 mm


Product details


GP-ASM2NE6100TTTD Gigabyte

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