Quick Code: Q MPN: KF560C36BBEK2-32
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Overview


Kingston FURY™ Beast DDR5 memory brings the latest, cutting-edge technology for next-gen gaming platforms. Taking speed, capacity and reliability even further, DDR5 arrives with an arsenal of enhanced features, like on-die ECC (ODECC) for improved stability at extreme speeds, dual 32-bit subchannels for increased efficiency and an on-module power management integrated circuit (PMIC) to provide juice where it’s needed most.

Superior speed advancements with double the banks from 16 to 32 and double the burst length from 8 to 16 take DDR5 memory, your gaming experience and your overall system applications to the next level of performance.

Whether you’re pushing the limits in your gaming with the most extreme settings, live streaming at 4K+ or pushing large animations and 3D rendering, Kingston FURY Beast DDR5 memory is the level-up you need, while seamlessly bridging style and unleashing performance.

With options featuring Intel® XMP 3.0 and AMD EXPO™, two new DDR5 overclock specs that include customisable profiles for speeds and timings, Kingston FURY Beast DDR5 has your compatible overclock solutions covered.

Greater starting speed performance
With an aggressive starting speed at 4800MT's, DDR5 is 50% faster than DDR4.

Improved stability for overclocking
On-die ECC (ODECC) helps maintain data integrity to sustain the ultimate performance while you push the limits!

Increased efficiency
Boosted by double the banks and burst length and two independent 32-bit subchannels, DDR5’s exceptional handling of data shines with the latest games, programs and demanding applications.

Intel® XMP 3.0 certified
Advanced pre-optimized timings, speed and voltage for overclocking performance and save new user-customizable profiles utilizing a programmable PMIC.

AMD EXPO certified
AMD’s Extended Profiles for Overclocking

Qualified by the world’s leading motherboard manufacturers*
Tested and approved so you can build and upgrade with confidence on your preferred motherboard.

Low-profile heat spreader
Newly designed heat spreaders in black or white combine bold styling and outstanding cooling functionality.




At-a-glance


  • AMD EXPO™ Certified

  • Greater performance starting at 4800MT/s

  • Improved stability for overclocking

  • Increased efficiency

  • Intel® XMP 3.0 Certified

  • Low-profile heat spreader design in black or white

  • Plug N Play at 4800MT/s***

  • Qualified by the world’s leading motherboard manufacturers**




Reasons to buy

  • AMD EXPO™ Certified
  • Greater performance starting at 4800MT/s
  • Improved stability for overclocking
  • Increased efficiency
  • Intel® XMP 3.0 Certified
  • Low-profile heat spreader design in black or white
  • Plug N Play at 4800MT/s***
  • Qualified by the world’s leading motherboard manufacturers**

Specification

Technical Description:

Features
JEDEC standard:
Yes
Backlight:Product has a built-in light source for its illuminating.
No
Lead plating:
Gold
Cooling type:The method used to cool the device or to cool the air around the device.
Heatsink
Country of origin:Country where the device is made.
China, Taiwan
Programming power voltage (VPP):
1.8 V
SPD profile:
Yes
AMD Extended Profiles for Overclocking (EXPO):
Yes
AMD Extended Profiles for Overclocking (EXPO) version:
1.0
Row active time:
32 ns
Refresh row cycle time:
295 ns
Row cycle time:
48 ns
Module configuration:
2048M x 64
Memory voltage:The voltage (V) of the memory in the device.
1.35 V
Memory ranking:
1
Memory data transfer rate:
6000 MT/s
CAS latency:Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
36
On-Die ECC:
Yes
ECC:ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
No
Memory form factor:Design of the memory e.g. 240-pin DIMM, SO-DIMM.
288-pin DIMM
Component for:What this product is used as a part of (component for).
PC/Server
Internal memory type:The type of internal memory such as RAM, GDDR5.
DDR5
Memory layout (modules x size):
2 x 16 GB
Internal memory:A computer's memory which is directly accessible to the CPU.
32 GB
Buffered memory type:
Unregistered (unbuffered)

General
Type:Characteristics of the device.
Memory RAM

Logistics data
Products per master (outer) case:
25 pc(s)
Master (outer) case gross weight:
2.75 kg
Master (outer) case height:
61 mm
Master (outer) case length:
311.2 mm
Master (outer) case width:
196.9 mm

Operational conditions
Storage temperature (T-T):The minimum and maximum temperatures at which the product can be safely stored.
-55 - 100 °C
Operating temperature (T-T):The minimum and maximum temperatures at which the product can be safely operated.
0 - 85 °C

Packaging data
Package weight:Weight of the packaged product.
101.7 g
Package height:The distance from the top to the bottom of the packaging.
171.5 mm
Package depth:The distance from the front to the back of the packaging.
14 mm
Package width:The distance from one side of the packaging to the other.
95.3 mm

Weight & dimensions
Weight:Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
77.1 g
Height:The measurement of the product from head to foot or from base to top.
34.8 mm
Depth:The distance from the front to the back of something.
133.4 mm
Width:The measurement or extent of something from side to side.
6.6 mm

Product details

KF560C36BBEK2-32 Kingston

£0.00 and

SKU: KF560C36BBEK2-32