Features
Memory voltage:The voltage (V) of the memory in the device.
1.5 V
CAS latency:Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
11
ECC:ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Memory form factor:Design of the memory e.g. 240-pin DIMM, SO-DIMM.
240-pin DIMM
Memory clock speed:The frequency at which the memory (e.g. RAM) runs.
1600 MHz
Internal memory type:The type of internal memory such as RAM, GDDR5.
DDR3
Memory layout (modules x size):
1 x 8 GB
Internal memory:A computer's memory which is directly accessible to the CPU.
8 GB
Buffered memory type:
Unregistered (unbuffered)
Logistics data
Harmonized System (HS) code:
84733020
Other features
Package dimensions (WxDxH):Dimensions of the packaged product (Width x Depth x Height).
118 x 16 x 180 mm
Packaging data
Package type:The type of product package e.g. box.
DIMM
Package weight:Weight of the packaged product.
36.7 g
Weight & dimensions
Weight:Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
10.2 g
Height:The measurement of the product from head to foot or from base to top.
29 mm
Depth:The distance from the front to the back of something.
3.6 mm
Width:The measurement or extent of something from side to side.
136 mm
