Quick Code: Q MPN: TDZAD432G4000HC18LDC01
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Overview


Memory for AMD
An AMD memory specially made for AMD’s latest Ryzen 3000 series processor and X570 motherboard. It is tested for complete compatibility and stability.

Reinforced structure, Enhanced heat dissipation
It is made by punch press process with a 0.8mm thick, one-piece alloy aluminum. In addition, coloring with the electrolytic anodizing process can offer corrosion resistance and make it non-conductive. By transferring the heat from superconductive thermal adhesive to alloy cooing modules through heat conduction, the overclocking memory can be maintained within operating temperature.

Selected IC chips, Stable and durable
TEAMGROUP DDR4 gaming memory specially made for AMD is selected through a rigorous testing process. Every overclocking memory is tested for complete compatibility and stability. This offers gamers a memory with excellent quality, optimal performance, stability, and compatibility.

High performance, Low power consumption, Easy upgrade
In addition to the increase in data transfer rate. This desktop memory is energy saving, high performance and low power consuming.

Supports OC Profile, One-click overclocking
T-FORCE DARK Za DDR4 Gaming Memory is plug and play ready. Overclocking is a snap without the hassle of manually adjusting the BIOS. One step and you are ready to experience the extreme speed sensation of overclocking memory.

T-FORCE
T-FORCE is TEAM force. The red “T” on the logo of “TF” represents TEAMGROUP’s passion for the storage products. The black “F” represents TEAMGROUP’s over 18 years of promotion of storage products. The visual design of the perfect combination elegantly symbolizes a pair of flying wings. They represent that the high quality and extreme performance gaming products from TEAMGROUP are capable of allowing all gamers to break the speed limit and enjoy the ever-changing world of gaming.




At-a-glance


  • Aluminum alloy heat sink with high performance

  • Armor design for perfect protection

  • Energy saving with ultra-low working voltage

  • High thermal conductive adhesive

  • OC Profile Support

  • Selected high-quality IC

  • Tailor made for AMD




Reasons to buy

  • Aluminum alloy heat sink with high performance
  • Armor design for perfect protection
  • Energy saving with ultra-low working voltage
  • High thermal conductive adhesive
  • OC Profile Support
  • Selected high-quality IC
  • Tailor made for AMD

Specification

Technical Description:

Features
Cooling type:The method used to cool the device or to cool the air around the device.
Heatsink
Memory voltage:The voltage (V) of the memory in the device.
1.4 V
CAS latency:Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
18
ECC:ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
No
Memory form factor:Design of the memory e.g. 240-pin DIMM, SO-DIMM.
288-pin DIMM
Component for:What this product is used as a part of (component for).
PC/Server
Memory clock speed:The frequency at which the memory (e.g. RAM) runs.
4000 MHz
Internal memory type:The type of internal memory such as RAM, GDDR5.
DDR4
Memory layout (modules x size):
2 x 16 GB
Internal memory:A computer's memory which is directly accessible to the CPU.
32 GB
Buffered memory type:
Unregistered (unbuffered)

Weight & dimensions
Height:The measurement of the product from head to foot or from base to top.
43.5 mm
Depth:The distance from the front to the back of something.
141 mm
Width:The measurement or extent of something from side to side.
8.3 mm

Product details

TDZAD432G4000HC18LDC01 Team

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SKU: TDZAD432G4000HC18LDC01