Quick Code: Q MPN: TF10D416G4000HC18JDC01
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Overview


Colorful full mirror finish
T-FORCE XTREEM ARGB DDR4 Gaming Memory’s full mirror reflection design concept leads the world in RGB gaming memory design and creates an incomparable RGB lighting effect. With colorful mirror design, the luminous memory allows the T-FORCE XTREEM ARGB to present the ultimate texture of optical technology.

Penetrating light, Cold light ARGB
T-FORCE XTREEM ARGB DDR4 Gaming Memory uses the principles of optical reflection and penetrating light guide, so the luminous area of the entire module can be maximized through the mirror-finish process design and let the light at the bottom passed through directly to present multi layers of the beauty of the reflective optics.

Selected IC chips, Stable and durable
The IC chip made for TEAMGROUP T-FORCE XTREEM ARGB DDR4 Gaming Memory is selected through a rigorous testing process. Each of them is tested for complete compatibility and stability. This offers gamers a DDR4 gaming memory with excellent quality, optimal performance, stability and compatibility.

High performance, Low power consumption, Easy upgrade
In addition to the increase in data transfer rate, the basic working voltage of the new generation of upgraded DDR4 memory is also decreased to 1.2V. This desktop memory is energy saving, high performance and low power consumption.

Supports Intel XMP, Auto overclocking
T-FORCE XTREEM ARGB DDR4 Gaming Memory is plug and play ready. Overclocking can be super easy without the hassle of manually adjusting the BIOS. It is compatible with both Intel & AMD platform, therefore gamers can build their system without worries.

T-FORCE XTREEM ARGB Gaming Memory Modules Supports Variety Kinds of Controlled Software
T-FORCE XTREEM ARGB memory module supports ASUS Aura Sync / GIGABYTE RGB Fusion 2.0 / MSI Mystic Light Sync / ASROCK-Polychrome Sync software. The lightning controlled software allows gamers to control lighting effects and lighting synchronization with T-FORCE XTREEM ARGB luminous memory module. It creates a unique, dazzling color aesthetics and offers a brilliant RGB system!




At-a-glance


  • Aluminum alloy heat sink with high performance

  • Chinese Utility Patent (number: CN 210039639 U)

  • Energy-saving with ultra-low working voltage

  • Full mirror light penetration

  • Latest ARGB technology

  • OC profile support

  • Selected high-quality IC

  • Supports Intel & AMD motherboards

  • Taiwan Utility Patent (number: M584969)




Reasons to buy

  • Aluminum alloy heat sink with high performance
  • Chinese Utility Patent (number: CN 210039639 U)
  • Energy-saving with ultra-low working voltage
  • Full mirror light penetration
  • Latest ARGB technology
  • OC profile support
  • Selected high-quality IC
  • Supports Intel & AMD motherboards
  • Taiwan Utility Patent (number: M584969)

Specification

Technical Description:

Features
Certification:
FCC, CE
Linux operating systems supported:8 RT. Linux (9.4, 9.5), Red Hat Enterprise Linux 5.0 (supported with a pre-built package); SUSE Linux (10.3, 11.0, 11, 11.1, 11.2), Fedora (9, 9.0, 10, 10.0, 11.0, 11, 12, 12.0), Ubuntu (8.04, 8.04.1, 8.04.2, 8.10, 9.04, 9.10, 10.04), Debian (5.0, 5.0.1, 5.0.2, 5.0.3)
Yes
Mac operating systems supported:Mac operating systems e.g. OS X can be used with the device.
Yes
Windows operating systems supported:Windows vesions wich can be used with the device.
Yes
Backlight colour:
Multicolour
Backlight:Product has a built-in light source for its illuminating.
Yes
Cooling type:The method used to cool the device or to cool the air around the device.
Heatsink
Intel Extreme Memory Profile (XMP):
Yes
Memory voltage:The voltage (V) of the memory in the device.
1.35 V
Memory channels:
Dual-channel
CAS latency:Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
18
ECC:ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
No
Memory form factor:Design of the memory e.g. 240-pin DIMM, SO-DIMM.
288-pin DIMM
Component for:What this product is used as a part of (component for).
PC/Server
Memory clock speed:The frequency at which the memory (e.g. RAM) runs.
4000 MHz
Internal memory type:The type of internal memory such as RAM, GDDR5.
DDR4
Memory layout (modules x size):
2 x 8 GB
Internal memory:A computer's memory which is directly accessible to the CPU.
16 GB
Buffered memory type:
Unregistered (unbuffered)

Logistics data
Harmonized System (HS) code:
84733020

Packaging data
Package type:The type of product package e.g. box.
Box
Package width:The distance from one side of the packaging to the other.
8.1 mm

Sustainability
Sustainability certificates:
RoHS

Weight & dimensions
Height:The measurement of the product from head to foot or from base to top.
48.7 mm
Depth:The distance from the front to the back of something.
8.1 mm
Width:The measurement or extent of something from side to side.
133.7 mm

Product details

TF10D416G4000HC18JDC01 Team

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SKU: TF10D416G4000HC18JDC01