Quick Code: Q MPN: TTCCD432G2666HC19DC01
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Overview



Team Group TTCCD432G2666HC19DC01. Component for: PC/Server, Internal memory: 32 GB, Memory layout (modules x size): 2 x 16 GB, Internal memory type: DDR4, Memory clock speed: 2666 MHz, Memory form factor: 288-pin DIMM, CAS latency: 19




Specification


Technical Description:

Features
Certification:
RoHS, CE, FCC
Cooling type:The method used to cool the device or to cool the air around the device.
Heatsink
Memory voltage:The voltage (V) of the memory in the device.
1.2 V
CAS latency:Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
19
ECC:ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
No
Memory form factor:Design of the memory e.g. 240-pin DIMM, SO-DIMM.
288-pin DIMM
Component for:What this product is used as a part of (component for).
PC/Server
Memory clock speed:The frequency at which the memory (e.g. RAM) runs.
2666 MHz
Internal memory type:The type of internal memory such as RAM, GDDR5.
DDR4
Memory layout (modules x size):
2 x 16 GB
Internal memory:A computer's memory which is directly accessible to the CPU.
32 GB
Buffered memory type:
Unregistered (unbuffered)

Logistics data
Harmonized System (HS) code:
84733020

Packaging data
Package type:The type of product package e.g. box.
Box

Weight & dimensions
Height:The measurement of the product from head to foot or from base to top.
32 mm
Depth:The distance from the front to the back of something.
7 mm
Width:The measurement or extent of something from side to side.
140 mm


Product details


TTCCD432G2666HC19DC01 Team

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