Quick Code: Q MPN: X570 AORUS ULTRA
£0.00

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Overview



DESIGN CONCEPT
DOMINANT IN DARKNESS
In the dark, starless night, the falcon strikes fear into the heart of its prey. Even with minimal visibility, the falcon pinpoints its prey and patiently anticipates the perfect moment to swoop in for the kill. The falcon with its laser sharp gaze dominates the darkness of night in the same manner that AORUS Core Lighting illuminates the vast AORUS ecosystem.

GET READY FOR AMD RYZEN™ 3000-SERIES
GIGABYTE X570 motherboards based on the AMD X570 Chipset provide full support for 3rd Gen AMD Ryzen™ Processors. The all-new design is a testament to GIGABYTE's dedication to design quality. GIGABYTE X570 motherboards offer a rich list of features such as support for PCIe 4.0 and USB Type-C™ interfaces on select boards, refined audio, high speed of Ethernet and latest standard of WIFI design, to fulfill users' performance, audio, and data transfer needs. The new, advanced power and thermal design enables users to unleash the performance on AMD Ryzen™ 3000-series Processors, making the GIGABYTE X570 motherboards perfect for users looking to build the best AMD platform gaming system.

AMD StoreMI Technology
GIGABYTE X570 motherboards maximize your PC's potential with AMD StoreMI technology. StoreMI accelerates traditional storage devices to reduce boot times and enhance the overall user experience. This easy-to-use utility combines the speed of SSDs with the high capacity of HDDs into a single drive, enhances the read/write speeds of the device to match that of SSDs, bolsters data performance for incredible value, and transforms the everyday PC to a performance driven system.

The benefits of AMD StoreMI:
- Making the PC experience fast, smooth and easy
- Optimizing computer responsiveness from system boot to application launch
- Offering SSD performance with HDD capacity at an affordable cost
- Quickly accessing key files by automatically learning users' computing behaviors

AORUS PERFORMANCE
Ultimate Power Design
To unleash the full potential of the 3rd Generation of AMD Ryzen™ CPU, the motherboard requires the best CPU power design. With the best quality components and GIGABYTE R&D design capability, the X570 AORUS is a true beast among motherboards.

Advanced Thermal Design
X570 AORUS ULTRA reaches a perfect balance between style and performance by combining the media acclaimed Fins-Array heatsink and Direct Touch heatpipe, to heatpipe provide 30% lower MOSFET temperatures for enthusiasts, overclockers and professional gamers.
Fins-Array Heatsink with Direct Touch Heatpipe and High Thermal Conductivity Pad
X570 AORUS ULTRA uses Fins-Array Heatsink which increases the heat dissipation area by 300% compared to traditional heatsinks of the same size. Direct Touch Heatpipe helps transfer heat from MOS fins. By using LAIRD 1.5mm thick, 5W/mK high thermal conductivity pads, it can transfer 2.7x more heat compared to traditional thermal pads in the same time period.

Full PCIe 4.0 Design
X570 AORUS pushes the envelope once again by featuring Full PCIe 4.0 Design, including PCIe 4.0 slots, PCIe 4.0 M.2 connectors, and delivering highly optimized performance and flexibility demanded for power users and extreme gaming enthusiasts.

AORUS CONNECTIVITY
Next Generation Connectivity
A high-end product needs to be future-proof so your system stays up-to-date with the latest technology. X570 AORUS motherboards provide all next generation network, storage, and WIFI connectivity to keep you up to speed.

AORUS AUDIO

ALC1220-VB Immersive Gaming ViBes
All New Realtek High-End HD Audio Codec
ALC1220 120dB(A) SNR HD Audio with Smart Headphone Amp automatically detects impedance of your head-worn audio device, preventing issues such as low volume and distortion.
With the new VB series audio controller, stream your voice to the world vibrantly with both front/rear microphone SNR up to 110/114dB(A).

High-End WIMA & Audio Capacitors
The AORUS motherboards boast a combination of Hi-Fi grade WIMA FKP2 capacitors and high-end Chemicon audio capacitors. While the high-end audio capacitors are suited for high-grade audio equipment, using state of the art technology to provide rich sound in the bass and clearer high frequencies, the WIMA FKP2 capacitors are being used widely in premium grade Hi-Fi systems. The addition of this to the exclusive AOURS AMP-UP Audio technology makes for the ideal onboard sound solution for the most demanding audiophiles.

AORUS STYLE
RGB Fusion 2.0
With AORUS Motherboards, RGB Fusion 2.0 is even better with Addressable LEDs.* RGB Fusion 2.0 offers users the option to control onboard RGB and external RGB / Addressable LED light strips for their PC. Already feature filled with colors and patterns, RGB Fusion 2.0 on X570 Series AORUS Motherboards are now upgraded with Addressable LED support. With external Addressable LED strips*, where each LED is digitally addressable, users can experience even more patterns, styles, and illuminations.

AORUS Motherboards will support 5v Addressable LED lighting strips and up to 300 LED lights. RGB Fusion 2.0 with Addressable LEDs comes with new patterns and various speed settings with more to come.

Multi-Zone Light Show Design
Now offering more LED customizations than ever, users can truly adapt their PC to represent their lifestyle. With full RGB support and a redesigned RGB Fusion 2.0 application, the user has complete control over the LEDs which surround the motherboard.

With a dazzling array of products supported, RGB Fusion 2.0 is the software that brings it all together, letting your accessories synchronize to the same beat. Customize all your LEDs how you like — have them match, dazzle and impress. Learn more about RGB Fusion 2.0

AORUS COOLING
Smart Fan 5
With Smart Fan 5 users can ensure that their gaming PC can maintain its performance while staying cool. Smart Fan 5 allows users to interchange their fan headers to reflect different thermal sensors at different locations on the motherboard. Not only that, with Smart Fan 5 more hybrid fan headers that support both PWM and Voltage mode fans have been introduced to make the motherboard more liquid cooling friendly.

Achieve fan silence. With Fan Stop, map any fan to stop completely when temperatures drop below a specified threshold. Which fan stops, based on readings from which sensor, and at what temperature—all of it can be customized to your liking.

AORUS ULTRA DURABLE
Q-Flash Plus
Update the BIOS easily without installing the CPU, memory and graphics card.

With GIGABYTE Q-Flash Plus, you don’t need to install the CPU, memory and graphics card nor enter the BIOS menu to flash the BIOS. Just download and save a new BIOS file (rename to gigabyte.bin) on the USB flash drive, then press the dedicated Q-Flash Plus button and you’re good to go!

Solid Pin Power Connectors
X570 AORUS motherboards feature solid plated ATX 24pin & ATX 12V 8pin + 4pin power connectors to offer a stable power supply during CPU overloading.

Ultra Durable™ PCIe Armor
Industry Leading Ultra Durable™ PCIe Armor
The innovative one piece stainless steel shielding design from GIGABYTE reinforces the PCIe connectors to provide the extra strength required to support heavy graphics cards.

Ultra Durable™ Memory Armor
AORUS' exclusive one piece stainless steel shielding design prevents against PCB distortion/twisting and plate bending, in addition to preventing any possible ESD interference

New User Interface
All new EASY MODE shows important hardware information in one page including CPU clock, Memory, Storage, Fan.
My Favorites
Add constantly used items into the favorite menu for quick access.
Storage Information
Show all kinds of storage information including SATA, PCIE and M.2 interface.
Changelog
List all changes before saving and exiting bios. Quickly review overall settings modification.
Optimized Memory Installation Reminder
Displays correct installation reminder message when user installs two memory modules but runs single channel mode.
Intuitive Load Line Curve
Clearly show each loadline calibration setting in an intuitive curve graph.

XSplit Gamecaster + Broadcaster: Cast Your Game Anytime, Anywhere
Now set up your stage and share the greatest gaming moments with XSplit Gamecaster + Broadcaster! Fully optimized social media integration is ready for real-time chats—keeping you notified yet focused in the game. It takes just one click to stream your gameplay to Twitch. Host your game like a pro!




At-a-glance



  • 12+2 Phases IR Digital VRM Solution with PowIRstage

  • Advanced Thermal Design with Fins-Array Heatsink and Direct Touch Heatpipe

  • ALC1220-VB Enhance 114dB(Rear)/ 110dB(Front) SNR in Microphone with WIMA Audio Capacitors

  • Dual Channel ECC/ Non-ECC Unbuffered DDR4, 4 DIMMs

  • Front & Rear USB 3.1 Gen2 Type-C™ Header & HDMI 2.0 support

  • Integrated I/O Shield Armor

  • Intel® Gigabit LAN with cFosSpeed Internet Accelerator Networking

  • Intel® WiFi 6 802.11ax 2T2R & BT 5

  • Q-Flash Plus update BIOS Without Installing CPU, Memory and Graphics card

  • RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design, Supports Addressable LED & RGB LED Strips

  • Smart Fan 5 features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP

  • Supports AMD 3rd Gen Ryzen™/ 2nd Gen Ryzen™/ 2nd Gen Ryzen™ with Radeon™ Vega Graphics/ Ryzen™ with Radeon™ Vega Graphics Processors

  • Triple Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with Triple Thermal Guards




Reasons to buy


  • 12+2 Phases IR Digital VRM Solution with PowIRstage
  • Advanced Thermal Design with Fins-Array Heatsink and Direct Touch Heatpipe
  • ALC1220-VB Enhance 114dB(Rear)/ 110dB(Front) SNR in Microphone with WIMA Audio Capacitors
  • Dual Channel ECC/ Non-ECC Unbuffered DDR4, 4 DIMMs
  • Front & Rear USB 3.1 Gen2 Type-C™ Header & HDMI 2.0 support
  • Integrated I/O Shield Armor
  • Intel® Gigabit LAN with cFosSpeed Internet Accelerator Networking
  • Intel® WiFi 6 802.11ax 2T2R & BT 5
  • Q-Flash Plus update BIOS Without Installing CPU, Memory and Graphics card
  • RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design, Supports Addressable LED & RGB LED Strips
  • Smart Fan 5 features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
  • Supports AMD 3rd Gen Ryzen™/ 2nd Gen Ryzen™/ 2nd Gen Ryzen™ with Radeon™ Vega Graphics/ Ryzen™ with Radeon™ Vega Graphics Processors
  • Triple Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with Triple Thermal Guards

Specification


Technical Description:

Back panel I/O ports
WiFi-AP antenna jack:
2
S/PDIF out port:S/PDIF (Sony/Philips Digital Interconnect Format) is a digital audio interconnect used in consumer audio equipment over relatively short distances. The signal is transmitted over either a coaxial cable with RCA connectors or a fibre optic cable with TOSLINK connectors.
Yes
Microphone in:The socket where a microphone is connected to the device.
Yes
Headphone outputs:Number of sockets /ports where headphones are connected.
1
HDMI version:
2.0
HDMI ports quantity:The number of sockets (ports) for HDMI connections. HDMI (High-Definition Multimedia Interface) is a compact audio/video interface for transferring uncompressed video data and compressed/uncompressed digital audio data from a HDMI-compliant device ("the source device") to a compatible computer monitor, video projector, digital television, or digital audio device. HDMI is a digital replacement for existing analog video standards.
1
Ethernet LAN (RJ-45) ports:Number of Ethernet LAN (RJ-45) ports (connecting interfaces) in the device. Ethernet LAN (RJ-45) ports allow a computer to connect to the ethernet.
1
USB 3.2 Gen 2 (3.1 Gen 2) Type-C ports quantity:
2
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity:
1
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity:
3
USB 2.0 ports quantity:Number of USB 2.0 ports (connecting interfaces) in the device. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), USB 2.0 ports are usually black.
4

BIOS
Desktop Management Interface (DMI) version:
2.7
System Management BIOS (SMBIOS) version:
2.7
Clear CMOS jumper:
Yes
ACPI version:
5.0
BIOS memory size:
256 Mbit
BIOS type:The BIOS (Basic Input/Output System) initializes and tests system hardware components, and loads a bootloader or an operating system from a mass memory device. The BIOS additionally provides abstraction layer for the hardware, i.e. a consistent way for application programs and operating systems to interact with the keyboard, display, and other input/output devices. There are several types of BIOS, including the motherboard ROM BIOS, video BIOS, drive controller BIOS, network adapter BIOS, and SCSI adapter BIOS.
UEFI AMI

Expansion slots
Number of M.2 (M) slots:
3
PCI Express x16 slots:
3
PCI Express x1 slots:
2

Features
Windows operating systems supported:Windows vesions wich can be used with the device.
Yes
PC health monitoring:
Fan, Temperature, Voltage
Audio output channels:An audio output channel is an electric circuit which acts as a path for a signal produced by a device. A device may have several audio output channels.
7.1 channels
Audio chip:
Realtek ALC1220-VB
Motherboard chipset:The chipset connects the microprocessor to the rest of the motherboard.
AMD X570
Motherboard chipset family:The category of motherboard chipset e.g. Intel, AMD.
AMD
Motherboard form factor:Design of the motherboard (ATX, BTX etc).
ATX
Component for:What this product is used as a part of (component for).
PC

Graphics
HDCP:High-bandwidth Digital Content Protection (HDCP) is a form of digital copy protection to prevent copying of digital audio and video content as it travels across connections.
Yes
Maximum resolution:The maximum number of pixels that can be displayed in the image. It is usually quoted as width × height,: for example, "1024 × 768" means the width is 1024 pixels and the height is 768 pixels.
4096 x 2160 pixels
Parallel processing technology support:Parallel processing technology is the simultaneous use of more than one CPU or processor core to execute a program or multiple computational threads. Ideally, parallel processing makes programs run faster because there are more engines (CPUs or Cores) running it. In practice, it is often difficult to divide a program in such a way that separate CPUs or cores can execute different portions without interfering with each other. Most computers have just one CPU, but some models have several, and multi-core processor chips are becoming the norm. There are even computers with thousands of CPUs.
2-Way CrossFireX, 2-Way SLI, Quad-GPU CrossFireX, Quad-GPU SLI

Internal I/O
RGB LED pin header:
Yes
12V power connector:
Yes
TPM connector:
Yes
Number of chassis fan connectors:
3
CPU fan connector:
Yes
ATX Power connector (24-pin):
Yes
Front panel connector:
Yes
Front panel audio connector:
Yes
Number of SATA III connectors:Serial ATA (Advanced Technology Attachment) (SATA) is a computer bus interface that connects host bus adapters to mass storage devices such as hard disk drives and optical drives. SATA III (revision 3.x) interface, formally known as SATA 6Gb/s, is a third generation SATA interface running at 6.0Gb/s. The bandwidth throughput, which is supported by the interface, is up to 600MB/s. This interface is backwards compatible with SATA 3 Gb/s interface.
6
USB 3.2 Gen 1 (3.1 Gen 1) connectors:
2
USB 2.0 connectors:The end of a cable with a USB 2.0 connector. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), in addition to the "USB 1.x Full Speed" signaling rate of 12 Mbit/s. USB 2.0 connectors are usually colored black.
2

Logistics data
Harmonized System (HS) code:
84733020

Memory
Unbuffered memory:
Yes
Maximum internal memory:The maximum internal memory which is available in the product.
128 GB
Supported memory clock speeds:Memory clock speed is the time it takes for a computer to complete basic operations. It refers to the computer's processing speed and is measured in hertz. It is however not such a reliable measure of a computer's speed as it doesn't take into account other factors like RAM and cache size.
2133,2400,2667,2933,3200,3300,3333,3400,3466,3600,3733,3800,3866,4000,4133,4266,4300,4400 MHz
Non-ECC:
Yes
ECC:ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Yes
Memory channels:
Dual-channel
Memory slots type:A memory slot, also known as a memory socket or RAM slot, is what allows computer memory (RAM) to be inserted into the computer. Depending on the motherboard, there will usually be 2 to 4 memory slots (sometimes more on high-end motherboards). The most common types of RAM are SDRAM and DDR for desktop computers and SODIMM for laptop computers, each having various types and speeds.
DIMM
Number of memory slots:
4
Supported memory types:Types of memory which can be used with the product.
DDR4-SDRAM

Network
Bluetooth version:The type of bluetooth technology in the product e.g. Bluetooth Smart (v4.0).
5.0
Bluetooth:Bluetooth is a low-power radio technology developed to replace the cables and wires currently used to link or connect electronic devices such as personal computers, printers, and a wide variety of handheld devices including mobile phones. Because it uses radio-wave connectivity, a Bluetooth-enabled device has a constant, established connection to whatever browser it uses. This saves the user the trouble of logging on to check for emails or news updates, for example.
Yes
Wi-Fi standards:The type of wireless local area network (LAN). It can be ad-hoc, where units in a network communicate peer-to-peer, or Infrastructure, where units communicate with each other via an access point A LAN interconnects computers in a small area e.g. home, school or office.
802.11a, 802.11b, 802.11g, Wi-Fi 4 (802.11n), Wi-Fi 5 (802.11ac), Wi-Fi 6 (802.11ax)
Wi-Fi:Popular technology that allows an electronic device to exchange data or connect to the internet wirelessly using radio waves.
Yes
Ethernet interface type:
Gigabit Ethernet
Ethernet LAN:An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.
Yes

Networking
Bluetooth version:The type of bluetooth technology in the product e.g. Bluetooth Smart (v4.0).
5.0
Bluetooth:Bluetooth is a low-power radio technology developed to replace the cables and wires currently used to link or connect electronic devices such as personal computers, printers, and a wide variety of handheld devices including mobile phones. Because it uses radio-wave connectivity, a Bluetooth-enabled device has a constant, established connection to whatever browser it uses. This saves the user the trouble of logging on to check for emails or news updates, for example.
Yes
Wi-Fi standards:The type of wireless local area network (LAN). It can be ad-hoc, where units in a network communicate peer-to-peer, or Infrastructure, where units communicate with each other via an access point A LAN interconnects computers in a small area e.g. home, school or office.
802.11a, 802.11b, 802.11g, Wi-Fi 4 (802.11n), Wi-Fi 5 (802.11ac), Wi-Fi 6 (802.11ax)
Wi-Fi:Popular technology that allows an electronic device to exchange data or connect to the internet wirelessly using radio waves.
Yes
Ethernet interface type:
Gigabit Ethernet
Ethernet LAN:An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.
Yes

Packaging content
Bundled software:Software distributed with another product such as a piece of computer hardware or other electronic device, or a group of software packages which are sold together. A software suite is an example of bundled software, as is software which is pre-installed on a new computer.
Norton® Internet Security (OEM version) cFosSpeed XSplit Gamecaster + Broadcaster (12 months license)

Processor
Compatible processor series:A processor which is compatible with this device, belongs to a 'series' which is part of 'family' e.g Celeron D, Celeron G, Celeron M, or, in some cases, is the same as 'family'.
2nd Generation AMD Ryzen™ 3, 3rd Generation AMD Ryzen™ 3, 2nd Generation AMD Ryzen™ 5, 3rd Generation AMD Ryzen 5, 2nd Generation AMD Ryzen™ 7, 3rd Generation AMD Ryzen™ 7, 3rd Generation AMD Ryzen™ 9
Processor socket:Mechanical component(s) that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the processor to be replaced without soldering.
Socket AM4
Processor manufacturer:The manufacturer that produced the processor.
AMD

Rear panel I/O ports
WiFi-AP antenna jack:
2
S/PDIF out port:S/PDIF (Sony/Philips Digital Interconnect Format) is a digital audio interconnect used in consumer audio equipment over relatively short distances. The signal is transmitted over either a coaxial cable with RCA connectors or a fibre optic cable with TOSLINK connectors.
Yes
Microphone in:The socket where a microphone is connected to the device.
Yes
Headphone outputs:Number of sockets /ports where headphones are connected.
1
HDMI version:
2.0
HDMI ports quantity:The number of sockets (ports) for HDMI connections. HDMI (High-Definition Multimedia Interface) is a compact audio/video interface for transferring uncompressed video data and compressed/uncompressed digital audio data from a HDMI-compliant device ("the source device") to a compatible computer monitor, video projector, digital television, or digital audio device. HDMI is a digital replacement for existing analog video standards.
1
Ethernet LAN (RJ-45) ports:Number of Ethernet LAN (RJ-45) ports (connecting interfaces) in the device. Ethernet LAN (RJ-45) ports allow a computer to connect to the ethernet.
1
USB 3.2 Gen 2 (3.1 Gen 2) Type-C ports quantity:
2
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity:
1
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity:
3
USB 2.0 ports quantity:Number of USB 2.0 ports (connecting interfaces) in the device. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), USB 2.0 ports are usually black.
4

Storage controllers
RAID levels:RAID is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required.
0, 1, 10
Supported storage drive interfaces:
M.2, SATA III

Weight & dimensions
Depth:The distance from the front to the back of something.
244 mm
Width:The measurement or extent of something from side to side.
305 mm


Product details


X570 AORUS ULTRA Gigabyte

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SKUX570 AORUS ULTRA