Quick Code: Q MPN: X570 AORUS XTREME
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Overview



DESIGN CONCEPT
Innovative design, cutting-edge function, state-of-art aesthetics, sophisticated thermal design, next generation network connection ,Hi-Fi level audio system. X570 AORUS XTREME is the new definition of flagship motherboard.

GET READY FOR AMD RYZEN™ 3000-SERIES
GIGABYTE X570 motherboards based on the AMD X570 Chipset provide full support for 3rd Gen AMD Ryzen™ Processors. The all-new design is a testament to GIGABYTE's dedication to design quality. GIGABYTE X570 motherboards offer a rich list of features such as support for PCIe 4.0 and USB Type-C™ interfaces on select boards, refined audio, high speed of Ethernet and latest standard of WIFI design, to fulfill users' performance, audio, and data transfer needs. The new, advanced power and thermal design enables users to unleash the performance on AMD Ryzen™ 3000-series Processors, making the GIGABYTE X570 motherboards perfect for users looking to build the best AMD platform gaming system.

AMD StoreMI Technology
GIGABYTE X570 motherboards maximize your PC's potential with AMD StoreMI technology. StoreMI accelerates traditional storage devices to reduce boot times and enhance the overall user experience. This easy-to-use utility combines the speed of SSDs with the high capacity of HDDs into a single drive, enhances the read/write speeds of the device to match that of SSDs, bolsters data performance for incredible value, and transforms the everyday PC to a performance driven system.

The benefits of AMD StoreMI:
- Making the PC experience fast, smooth and easy
- Optimizing computer responsiveness from system boot to application launch
- Offering SSD performance with HDD capacity at an affordable cost
- Quickly accessing key files by automatically learning users' computing behaviors

Extreme Power Design
To unleash the full potential of the 3rd Generation of AMD Ryzen™ CPU, the motherboard requires the best CPU power design. With the best quality components and GIGABYTE R&D design capability, X570 AORUS XTREME is a true beast among motherboards.

THERMAL REACTIVE ARMOR
X570 AORUS XTREME uses some unprecedented and innovative thermal design to ensure CPU, Chipset, SSD stability and low temperature under full loading application and gaming.

Unparalleled Performance
Hungry for better performance? X570 AORUS XTREME has full PCIe 4.0 design, supports high frequency memory, and full SSD thermal guard to make sure you get the maximum full system performance.

Next Generation Connectivity
A Flagship product needs to be future-proof so your system stays up-to-date with the latest technology. X570 AORUS XTREME provides all next generation network, storage, and WIFI connectivity to keep you up to speed.

Definitive Aesthetics
GIGABYTE ID team designs X570 AORUS XTREME from the drawing board. After countless hours of conceptualizing ideas, fine tuning details and engaging in discussion, GIGABYTE has produced a board that is equal parts beast and beauty.

HIFI AUDIO SYSTEM
Hi-Fi Audio System- As a Built-in Sound Card
For Hi-Fi Audio Solution, can be grouped into 2 parts.
Audio Signal Process, not distorted digital signal go through ESS 9218 Sabre DAC for Digital/Analog converter with 130dB SNR, 112dB THD+N and supports higher impedance up to 600 O headphone. Further, audiophile grade capacitor and gold plated audio jack ensures the non-compensated audio performance. Audio Signal Optimization, TXC Oscillator provides precise time triggers to Digital-Analog Converters. WIMA Capacitors to deliver crystal and balanced sound.

Precise TXC Oscillator
Provides precise time triggers to Digital-Analog Converters.

Audiophile Grade Capacitors
Famous WIMA capacitors are used as feedback signal processing to deliver crystal and balanced sound.

Ultra Durable
GIGABYTE is reputable for its durability and high quality manufacturing process. Needless to say, we use the best components we can find on the X570 AORUS XTREME and reinforce every slot to make each of them solid and durable.

GIGABYTE BIOS & APP CENTER
GIGABYTE is famous for its durability and high quality manufacture process, needless to say, we use the best components we can find on X570 AORUS XTREME and reinforce on every slot to make it solid durable.

XSplit Gamecaster + Broadcaster: Cast Your Game Anytime, Anywhere
Now set up your stage and share the greatest gaming moments with XSplit Gamecaster + Broadcaster! Fully optimized social media integration is ready for real-time chats—keeping you notified yet focused in the game. It takes just one click to stream your gameplay to Twitch. Host your game like a pro!




At-a-glance



  • AQUANTIA® 10GbE BASE-T LAN + Intel® Gigabit LAN with cFosSpeed

  • Direct 16 Phases Infineon Digital VRM Solution with 70A Power Stage

  • Dual Channel ECC/ Non-ECC Unbuffered DDR4, 4 DIMMs

  • Exclusive RGB FAN COMMANDER for Professional Casemoders

  • Front & Rear USB 3.2 Gen 2 Type-C™ Headers

  • Onboard Intel® WiFi 6 802.11ax 2T2R & BT 5 with 2X AORUS Antenna

  • Q-Flash Plus Update BIOS Without Installing CPU, Memory and Graphics Card

  • Rear 130dB SNR AMP-UP Audio with ALC1220-VB & ESS SABRE 9218 DAC with WIMA Audio Capacitors

  • RGB FUSION with Multi-Zone Addressable LED Light Show Design, Support Addressable LED & RGB LED Strips

  • Smart Fan 5 Features Multiple Temperature Sensors , Hybrid Fan Headers with FAN STOP and Noise Detection

  • Supports AMD 3rd Gen Ryzen™/ 2nd Gen Ryzen™/ 2nd Gen Ryzen™ with Radeon™ Vega Graphics/ Ryzen™ with Radeon™ Vega Graphics Processors

  • Thermal Reactive Armor Design with Fins-Array Heatsink, Direct Touch Heatpipe and NanoCarbon Baseplate

  • Triple Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with Triple Thermal Guards

  • USB TurboCharger for Mobile Device Fast Charge Support




Reasons to buy


  • AQUANTIA® 10GbE BASE-T LAN + Intel® Gigabit LAN with cFosSpeed
  • Direct 16 Phases Infineon Digital VRM Solution with 70A Power Stage
  • Dual Channel ECC/ Non-ECC Unbuffered DDR4, 4 DIMMs
  • Exclusive RGB FAN COMMANDER for Professional Casemoders
  • Front & Rear USB 3.2 Gen 2 Type-C™ Headers
  • Onboard Intel® WiFi 6 802.11ax 2T2R & BT 5 with 2X AORUS Antenna
  • Q-Flash Plus Update BIOS Without Installing CPU, Memory and Graphics Card
  • Rear 130dB SNR AMP-UP Audio with ALC1220-VB & ESS SABRE 9218 DAC with WIMA Audio Capacitors
  • RGB FUSION with Multi-Zone Addressable LED Light Show Design, Support Addressable LED & RGB LED Strips
  • Smart Fan 5 Features Multiple Temperature Sensors , Hybrid Fan Headers with FAN STOP and Noise Detection
  • Supports AMD 3rd Gen Ryzen™/ 2nd Gen Ryzen™/ 2nd Gen Ryzen™ with Radeon™ Vega Graphics/ Ryzen™ with Radeon™ Vega Graphics Processors
  • Thermal Reactive Armor Design with Fins-Array Heatsink, Direct Touch Heatpipe and NanoCarbon Baseplate
  • Triple Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with Triple Thermal Guards
  • USB TurboCharger for Mobile Device Fast Charge Support

Specification


Technical Description:

Back panel I/O ports
S/PDIF out port:S/PDIF (Sony/Philips Digital Interconnect Format) is a digital audio interconnect used in consumer audio equipment over relatively short distances. The signal is transmitted over either a coaxial cable with RCA connectors or a fibre optic cable with TOSLINK connectors.
Yes
Microphone in:The socket where a microphone is connected to the device.
Yes
Headphone outputs:Number of sockets /ports where headphones are connected.
1
Ethernet LAN (RJ-45) ports:Number of Ethernet LAN (RJ-45) ports (connecting interfaces) in the device. Ethernet LAN (RJ-45) ports allow a computer to connect to the ethernet.
2
USB 3.2 Gen 2 (3.1 Gen 2) Type-C ports quantity:
1
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity:
5
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity:
2
USB 2.0 ports quantity:Number of USB 2.0 ports (connecting interfaces) in the device. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), USB 2.0 ports are usually black.
4

BIOS
Desktop Management Interface (DMI) version:
2.7
System Management BIOS (SMBIOS) version:
2.7
Clear CMOS button:
Yes
ACPI version:
5.0
BIOS memory size:
256 Mbit
BIOS type:The BIOS (Basic Input/Output System) initializes and tests system hardware components, and loads a bootloader or an operating system from a mass memory device. The BIOS additionally provides abstraction layer for the hardware, i.e. a consistent way for application programs and operating systems to interact with the keyboard, display, and other input/output devices. There are several types of BIOS, including the motherboard ROM BIOS, video BIOS, drive controller BIOS, network adapter BIOS, and SCSI adapter BIOS.
UEFI AMI

Expansion slots
Number of M.2 (M) slots:
3
PCI Express x16 slots:
3

Features
Windows operating systems supported:Windows vesions wich can be used with the device.
Yes
PC health monitoring:
Fan, Temperature, Voltage
Audio output channels:An audio output channel is an electric circuit which acts as a path for a signal produced by a device. A device may have several audio output channels.
7.1 channels
Audio chip:
Realtek ALC1220-VB
Motherboard chipset:The chipset connects the microprocessor to the rest of the motherboard.
AMD X570
Motherboard chipset family:The category of motherboard chipset e.g. Intel, AMD.
AMD
Motherboard form factor:Design of the motherboard (ATX, BTX etc).
Extended ATX
Component for:What this product is used as a part of (component for).
PC

Graphics
Parallel processing technology support:Parallel processing technology is the simultaneous use of more than one CPU or processor core to execute a program or multiple computational threads. Ideally, parallel processing makes programs run faster because there are more engines (CPUs or Cores) running it. In practice, it is often difficult to divide a program in such a way that separate CPUs or cores can execute different portions without interfering with each other. Most computers have just one CPU, but some models have several, and multi-core processor chips are becoming the norm. There are even computers with thousands of CPUs.
2-Way CrossFireX, 2-Way SLI, Quad-GPU CrossFireX, Quad-GPU SLI

Internal I/O
RGB LED pin header:
Yes
12V power connector:
Yes
TPM connector:
Yes
Number of chassis fan connectors:
4
CPU fan connector:
Yes
ATX Power connector (24-pin):
Yes
Front panel connector:
Yes
Front panel audio connector:
Yes
Number of SATA III connectors:Serial ATA (Advanced Technology Attachment) (SATA) is a computer bus interface that connects host bus adapters to mass storage devices such as hard disk drives and optical drives. SATA III (revision 3.x) interface, formally known as SATA 6Gb/s, is a third generation SATA interface running at 6.0Gb/s. The bandwidth throughput, which is supported by the interface, is up to 600MB/s. This interface is backwards compatible with SATA 3 Gb/s interface.
6
USB 3.2 Gen 1 (3.1 Gen 1) connectors:
2
USB 2.0 connectors:The end of a cable with a USB 2.0 connector. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), in addition to the "USB 1.x Full Speed" signaling rate of 12 Mbit/s. USB 2.0 connectors are usually colored black.
1

Logistics data
Harmonized System (HS) code:
84733020

Memory
Unbuffered memory:
Yes
Maximum internal memory:The maximum internal memory which is available in the product.
128 GB
Supported memory clock speeds:Memory clock speed is the time it takes for a computer to complete basic operations. It refers to the computer's processing speed and is measured in hertz. It is however not such a reliable measure of a computer's speed as it doesn't take into account other factors like RAM and cache size.
2133,2400,2667,2933,3200,3300,3333,3400,3466,3600,3733,3800,3866,4000,4133,4266,4300,4400 MHz
Non-ECC:
Yes
ECC:ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Yes
Memory channels:
Dual-channel
Memory slots type:A memory slot, also known as a memory socket or RAM slot, is what allows computer memory (RAM) to be inserted into the computer. Depending on the motherboard, there will usually be 2 to 4 memory slots (sometimes more on high-end motherboards). The most common types of RAM are SDRAM and DDR for desktop computers and SODIMM for laptop computers, each having various types and speeds.
DIMM
Number of memory slots:
4
Supported memory types:Types of memory which can be used with the product.
DDR4-SDRAM

Network
Bluetooth version:The type of bluetooth technology in the product e.g. Bluetooth Smart (v4.0).
5.0
Bluetooth:Bluetooth is a low-power radio technology developed to replace the cables and wires currently used to link or connect electronic devices such as personal computers, printers, and a wide variety of handheld devices including mobile phones. Because it uses radio-wave connectivity, a Bluetooth-enabled device has a constant, established connection to whatever browser it uses. This saves the user the trouble of logging on to check for emails or news updates, for example.
Yes
Wi-Fi standards:The type of wireless local area network (LAN). It can be ad-hoc, where units in a network communicate peer-to-peer, or Infrastructure, where units communicate with each other via an access point A LAN interconnects computers in a small area e.g. home, school or office.
802.11a, 802.11b, 802.11g, Wi-Fi 4 (802.11n), Wi-Fi 5 (802.11ac), Wi-Fi 6 (802.11ax)
Wi-Fi:Popular technology that allows an electronic device to exchange data or connect to the internet wirelessly using radio waves.
Yes
Ethernet interface type:
2.5 Gigabit Ethernet, 5 Gigabit Ethernet, 10 Gigabit Ethernet, Fast Ethernet, Gigabit Ethernet
Ethernet LAN:An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.
Yes

Networking
Bluetooth version:The type of bluetooth technology in the product e.g. Bluetooth Smart (v4.0).
5.0
Bluetooth:Bluetooth is a low-power radio technology developed to replace the cables and wires currently used to link or connect electronic devices such as personal computers, printers, and a wide variety of handheld devices including mobile phones. Because it uses radio-wave connectivity, a Bluetooth-enabled device has a constant, established connection to whatever browser it uses. This saves the user the trouble of logging on to check for emails or news updates, for example.
Yes
Wi-Fi standards:The type of wireless local area network (LAN). It can be ad-hoc, where units in a network communicate peer-to-peer, or Infrastructure, where units communicate with each other via an access point A LAN interconnects computers in a small area e.g. home, school or office.
802.11a, 802.11b, 802.11g, Wi-Fi 4 (802.11n), Wi-Fi 5 (802.11ac), Wi-Fi 6 (802.11ax)
Wi-Fi:Popular technology that allows an electronic device to exchange data or connect to the internet wirelessly using radio waves.
Yes
Ethernet interface type:
2.5 Gigabit Ethernet, 5 Gigabit Ethernet, 10 Gigabit Ethernet, Fast Ethernet, Gigabit Ethernet
Ethernet LAN:An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.
Yes

Other features
Weight:Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
1 kg

Packaging content
Bundled software:Software distributed with another product such as a piece of computer hardware or other electronic device, or a group of software packages which are sold together. A software suite is an example of bundled software, as is software which is pre-installed on a new computer.
Norton® Internet Security (OEM version) cFosSpeed XSplit Gamecaster + Broadcaster (12 months license)

Processor
Compatible processor series:A processor which is compatible with this device, belongs to a 'series' which is part of 'family' e.g Celeron D, Celeron G, Celeron M, or, in some cases, is the same as 'family'.
2nd Generation AMD Ryzen™ 3, 3rd Generation AMD Ryzen™ 3, 2nd Generation AMD Ryzen™ 5, 3rd Generation AMD Ryzen 5, 2nd Generation AMD Ryzen™ 7, 3rd Generation AMD Ryzen™ 7, 3rd Generation AMD Ryzen™ 9
Processor socket:Mechanical component(s) that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the processor to be replaced without soldering.
Socket AM4
Processor manufacturer:The manufacturer that produced the processor.
AMD

Rear panel I/O ports
S/PDIF out port:S/PDIF (Sony/Philips Digital Interconnect Format) is a digital audio interconnect used in consumer audio equipment over relatively short distances. The signal is transmitted over either a coaxial cable with RCA connectors or a fibre optic cable with TOSLINK connectors.
Yes
Microphone in:The socket where a microphone is connected to the device.
Yes
Headphone outputs:Number of sockets /ports where headphones are connected.
1
Ethernet LAN (RJ-45) ports:Number of Ethernet LAN (RJ-45) ports (connecting interfaces) in the device. Ethernet LAN (RJ-45) ports allow a computer to connect to the ethernet.
2
USB 3.2 Gen 2 (3.1 Gen 2) Type-C ports quantity:
1
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity:
5
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity:
2
USB 2.0 ports quantity:Number of USB 2.0 ports (connecting interfaces) in the device. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), USB 2.0 ports are usually black.
4

Storage controllers
RAID levels:RAID is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required.
0, 1, 10
Supported storage drive interfaces:
M.2, SATA III

Weight & dimensions
Height:The measurement of the product from head to foot or from base to top.
130 mm
Depth:The distance from the front to the back of something.
270 mm
Width:The measurement or extent of something from side to side.
305 mm


Product details


X570 AORUS XTREME Gigabyte

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SKUX570 AORUS XTREME